Labs and instruments

Support Laboratory – Hydrogen Technology Center

Charles University in Prague

The Support Laboratory of the Hydrogen Technology Center is focused on the preparation of thin layers.

Coating techniques available for users:

Magnetron sputtering

HTC Physical Vapor Deposition (PVD) facilities include two magnetron sputtering systems equipped with TORUS (K. J. Lesker) balanced magnetron cathodes and Alicat mass flow controllers, allowing precise control of process gases and deposition parameters.

These systems enable the fabrication of well-defined thin films or nanostructured islands with thicknesses ranging from approximately 0.5 nm to 500 nm, using any material available in the form of a sputtering target. Reactive gases such as N₂ or O₂ can be introduced during deposition to prepare nitrides or oxides from elemental targets (e.g., Ti to TiOx).

Thanks to the availability of both DC and RF power supplies, our setup supports the deposition of both conductive and non-conductive materials (e.g., ceramics like CeO₂ or CeF₃). By co-sputtering from multiple targets, we can also synthesize alloys and mixtures with tailored compositions.

Sample Size & Uniformity:

  • For single-material deposition, substrates up to 8×8 cm² can be coated.
  • For multimetallic co-sputtering, we recommend smaller substrates (up to 3×3 cm²) to ensure compositional uniformity.

If you require larger samples or have specific needs, please contact us to discuss your options.

Available Systems:

1. Compact Sputtering System (“Red magnetron”)

  • Cathodes: Three 2-inch TORUS (K. J. Lesker) magnetrons
  • Mass Flow Controllers: Alicat (1–50 sccm range)
  • Base Pressure: ~10⁻⁴ Pa
  • Sample Stage: Flat, shiftable substrate holder accommodating up to 5 samples per vacuum cycle

2. Advanced Load-Lock System (“Big magnetron”)

  • Cathodes: Three 4-inch TORUS (K. J. Lesker) magnetrons
  • Mass Flow Controllers: Alicat (1–50 sccm range)
  • Base Pressure: ~10⁻⁵ Pa
  • Load-Lock Chamber: Allows rapid sample exchange and enhanced vacuum control
  • Sample Plate: 9×9 cm metal plate, can be coated from both sides (suitable for 2 different sputterings per vacuum cycle)

Both systems support simultaneous co-sputtering from up to three sources, with flexible configuration for DC or RF power.

Targets available: Ir, Ru, Pt, Au, C, Ni, Fe, Co, CeO2, CeF3, Mn, Mo, Ti, TiC, Sn, SnO2, Cu, V

Ultrasonic spray coating

Available equipment:      

SonoTek ExactaCoat: an automated, programmable ultrasonic spray coating system for preparation of the thin film coatings. Compared to many other coating systems, ultrasonic spray nozzles are more precise, controllable,  repeatable, and environmentally friendly.

Sono-Tek ultrasonic nozzles break apart agglomerated particles as they travel through the nozzle body thanks to continuous ultrasonic vibrations along its length. This results in highly effective use of functional particles. By breaking up agglomerates into evenly dispersed catalyst layers, ultrasonic spray enables higher electrochemical performance and greater repeatability of functional coatings.

Application:

  • Catalytic layers for fuel cells and electrolyzers
  • Coatings for solar cells and sensors
  • Protective and electrically conductive coatings, etc.

Specifications:

  • Maximal work area: 400 × 400 × 100 mm
  • Heat and vacuum plate: 150 °C, 250 °C heat/vac, or 500 °C heat
  • Liquid delivery: Syringe pump (standard and sonic)
  • Ultrasonic nozzle designs: Impact
  • XYZ coordinated motion control of the nozzle

Mayer rod technique

Available equipment: Spiral Film Applicator, Model 358 (Erichsen)

Description:

The Mayer rod technique, is a simple and widely used method for manual film application with control over the thickness and width of catalytic layers.

Key specifications:

  • Width of the catalytic layer: Up to 22 cm
  • Wet layer thickness range: 10 to 120 micrometers

Contact:           
Dr. Yevheniia Lobko (+420 9 5155 2251, lobkoeugenia@gmail.com)